Sense, Store, Compute, and Soar with Cloud Wisdom Core | Dongguan Hosts a Technical Seminar on PHM-Specific Intelligent Sensing Chips, Embarking on a New Journey of Fault Diagnosis

With the rapid development in Industry 4.0 and intelligent manufacturing, efficient and precise intelligent sensing chips, as the bridge connecting the physical and digital worlds, are becoming increasingly important. The 2024 First PHM Dedicated Intelligent Sensing Chip Technology Seminar, jointly hosted by Dongguan Integrated Circuit Innovation Center and Wuhan Zhongyun Kangchong Technology Co., Ltd., and undertaken by Guangdong Zhongyun Xindi Technology Co., Ltd., was grandly held in Songshan Lake, Dongguan, Guangdong Province on November 26.

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At the meeting, Guangdong Zhongyun Xindi Technology Co., Ltd. ceremoniously released its latest research and development integrated energy, sensing, storage, and computing in one fault diagnosis dedicated intelligent chip - SoarC1.0 Xiangyun No. 1 This is not only a positive response to the global development trend of the intelligent sensing industry, but also an important exploration of the future development of sensor technology.

With the rapid development in Industry 4.0 and intelligent manufacturing, efficient and precise intelligent sensing chips, as the bridge connecting the physical and digital worlds, are becoming increasingly important. The 2024 First PHM Dedicated Intelligent Sensing Chip Technology Seminar, jointly hosted by Dongguan Integrated Circuit Innovation Center and Wuhan Zhongyun Kangchong Technology Co., Ltd., and undertaken by Guangdong Zhongyun Xindi Technology Co., Ltd., was grandly held in Songshan Lake, Dongguan, Guangdong Province on November 26.

At the meeting, Guangdong Zhongyun Xindi Technology Co., Ltd. ceremoniously released its latest research and development integrated energy, sensing, storage, and computing in one fault diagnosis dedicated intelligent chip - SoarC1.0 Xiangyun No. 1 This is not only a positive response to the global development trend of the intelligent sensing industry, but also an important exploration of the future development of sensor technology.

The conference focused on the frontier exploration of intelligent sensing chips and sensors, industry development dynamics, and a wide range of application scenarios, aiming to promote technical exchanges and cooperation in the industry and promote the advancement and industrialization of intelligent sensor technology. It brought together many elites in the industry, with many experts and scholars gathering together to share and discuss PHM intelligent sensor chip technology and development, showcasing the latest achievements of research institutions and Zhongyun Xindi in the field of intelligent sensing chips, providing an excellent platform for communication and learning for practitioners, researchers, and enthusiasts in this field.

The conference focused on the frontier exploration of intelligent sensing chips and sensors, industry development dynamics, and a wide range of application scenarios, aiming to promote technical exchanges and cooperation in the industry and promote the advancement and industrialization of intelligent sensor technology. It brought together many elites in the industry, with many experts and scholars gathering together to share and discuss PHM intelligent sensor chip technology and development, showcasing the latest achievements of research institutions and Zhongyun Xindi in the field of intelligent sensing chips, providing an excellent platform for communication and learning for practitioners, researchers, and enthusiasts in this field.

Lin Huajuan, executive director of Dongguan Integrated Circuit Innovation Center, said Dongguan has obvious advantages in industrial agglomeration, policy support, innovation platform construction, industrial chain development, industrial collaborative innovation, and the active promotion of the third-generation semiconductor industry in the field of intelligent sensing chips. The establishment of Guangdong Zhongyun Xindi Technology Co., Ltd. in Dongguan and the release of the Xiangyun No. 1 chip have injected a "strong heart" into the intelligent sensing chip field, laying a solid foundation for the future development of Dongguan's intelligent sensing chip industry.

Lin Huajuan, executive director of Dongguan Integrated Circuit Innovation Center, said Dongguan has obvious advantages in industrial agglomeration, policy support, innovation platform construction, industrial chain development, industrial collaborative innovation, and the active promotion of the third-generation semiconductor industry in the field of intelligent sensing chips. The establishment of Guangdong Zhongyun Xindi Technology Co., Ltd. in Dongguan and the release of the Xiangyun No. 1 chip have injected a "strong heart" into the intelligent sensing chip field, laying a solid foundation for the future development of Dongguan's intelligent sensing chip industry.

Dr. Wang Chengcheng from the Mechanical Industry Instrument and Meter Comprehensive Technology and Economics Research Institute shared "Introduction to National Intelligent Sensor Standards". In today's booming development of intelligent sensor technology, the formulation of standards is irreplaceable in regulating the industry, promoting the orderly promotion of technology, and ensuring product quality and compatibility.

Dr. Lou Liang from Shanghai Institute of Microsystem and Information Technology focused on "MEMS Vibration Sensors". MEMS vibration sensors are widely used in industrial production, equipment monitoring, and many other fields. Dr. Lou Liang, through easy-to-understand explanations, analyzed the technical principles, performance characteristics, current research hotspots, and development trends of MEMS vibration sensors.

Dr. Huang Yuzong from the Hong Kong University of Science and Technology focused on "Key Technologies of Analog In-Memory Computing Chips". With the explosive growth of data volume, traditional computing architectures face bottlenecks in data transmission bandwidth and energy consumption, and analog in-memory computing chip technology has emerged. Dr. Huang Yuzong detailed the key points of this technology and discussed its huge potential in improving computing efficiency and reducing energy consumption.

Dr. Huang Yuzong from the Hong Kong University of Science and Technology focused on "Key Technologies of Analog In-Memory Computing Chips". With the explosive growth of data volume, traditional computing architectures face bottlenecks in data transmission bandwidth and energy consumption, and analog in-memory computing chip technology has emerged. Dr. Huang Yuzong detailed the key points of this technology and discussed its huge potential in improving computing efficiency and reducing energy consumption.

Xu Mingwei, CTO of Shenzhen Huixin Communication Technology Co., Ltd. shared "FLAB: Exploring Innovative Models for Specialty Semiconductors", which prompted attendees to think deeply about innovative models for semiconductor technology. In the fiercely competitive semiconductor industry, exploring an innovative model suitable for its own development is the key for enterprises to stand out.

Xu Mingwei, CTO of Shenzhen Huixin Communication Technology Co., Ltd. shared "FLAB: Exploring Innovative Models for Specialty Semiconductors", which prompted attendees to think deeply about innovative models for semiconductor technology. In the fiercely competitive semiconductor industry, exploring an innovative model suitable for its own development is the key for enterprises to stand out.

Gao Xiang, general manager of Guangdong Zhongyun Xindi Co., Ltd., ceremoniously released the SoarC1.0 Xiangyun chip prototype and analyzed the application prospect of intelligent sensing chips in the PHM field. With the explosive growth of sensing needs in the Internet of Things field, sensors are also undergoing intelligent upgrades, and the SoarC1.0 Xiangyun chip has emerged as a result, allowing people to see the broad application space of the Xiangyun chip in predictive maintenance and other aspects, and promoting the development of intelligent sensors towards miniaturization, integration, modularization, intelligence, and passivity.

Gao Xiang, general manager of Guangdong Zhongyun Xindi Co., Ltd., ceremoniously released the SoarC1.0 Xiangyun chip prototype and analyzed the application prospect of intelligent sensing chips in the PHM field. With the explosive growth of sensing needs in the Internet of Things field, sensors are also undergoing intelligent upgrades, and the SoarC1.0 Xiangyun chip has emerged as a result, allowing people to see the broad application space of the Xiangyun chip in predictive maintenance and other aspects, and promoting the development of intelligent sensors towards miniaturization, integration, modularization, intelligence, and passivity.

In the future, with continuous technological advancements and expanding application fields, intelligent sensing chips will play an important role in more fields, jointly building a more intelligent, efficient, and secure intelligent sensing chip industrial cluster, and Zhongyun Xindi will continue to forge ahead in this field and create more brilliant chapters!

Guangdong Zhongyun Xindi Technology Co., Ltd.

In the future, with continuous technological advancements and expanding application fields, intelligent sensing chips will play an important role in more fields, jointly building a more intelligent, efficient, and secure intelligent sensing chip industrial cluster, and Zhongyun Xindi will continue to forge ahead in this field and create more brilliant chapters!