The "Beyond Moore, New-Quality Leap" event was successfully held, marking the global debut of Zhongyun Xindi's first-ever chip.

May 22, featuring "Beyond Moore's Law, A New Leap Forward" The inaugural event showcasing the achievements of Dongguan's first-ever strategic scientist team, themed around cutting-edge innovation, was successfully held at the Dongguan-Songshan Lake International Innovation and Entrepreneurship Community. During the event, Guangdong Zhongyun Xindi, backed by Zhongyun Technology Investment, unveiled the world's first ultra-low-power AI chip integrating "sensing, computing, and storage," which instantly became the center of attention and is set to inject new momentum into the advancement of the intelligent era.

I. Activity Background and Organization

This event has received strong support from multiple parties, with guiding organizations including the Organization Department of the Dongguan Municipal Committee, the Dongguan Science and Technology Bureau, the Dongguan Development and Reform Bureau, and the Management Committee of the Dongguan Songshan Lake High-Tech Industrial Development Zone, among others. The event is organized by the Dongguan Integrated Circuit Innovation Center and Sanjieji (Guangdong) Technology Co., Ltd. As one of the implementing entities, Zhongyun Technology has actively participated in the preparation and organization of the event, working closely with partners such as the Dongguan Integrated Circuit Industry Association and Guangdong Shulian Zhizao Technology Co., Ltd. to ensure the smooth execution of the program.

II. A Review of the Event's Exciting Agenda

On the morning of May 22

Event Check-in and Opening Ceremony: Starting at 9:30, guests began checking in and entering one after another. From 10:15 to 10:30, the leaders delivered their speeches, highlighting the event's significance and sharing their expectations.

Important Launch Ceremony: 10:45 - 10:50, Dongguan City's first strategic scientist team held a grand launch ceremony for its groundbreaking innovation achievements, along with a signing and awarding ceremony. A series of significant scientific research breakthroughs are soon set to enter the market.

Thematic Report: The keynote report titled "From the IC Era to the IS Era: Advanced Packaging Leads New Trends in Semiconductor Innovation," presented from 10:50 to 11:00, will provide attendees with cutting-edge insights and trend analysis.

The afternoon of May 22

Professional Networking Event: The Semiconductor Equipment Technology Innovation and Industry Upgrade Exchange Meeting, held from 2:00 PM to 4:30 PM, took place concurrently with the 2nd Session of the 1st Annual General Meeting of the Dongguan Integrated Circuit Industry Association, bringing together industry experts and business representatives for in-depth discussions and exchanges.

Technical Seminar: The second Post-Moore Era Glass Substrate Technology Seminar was also held that afternoon, focusing on technological innovations in niche areas.

III. Highlights of China's Cloudcore Global's First Chip

The globally first "compute-in-memory" low-power AI chip, launched at the event by Guangdong Zhongyun XinDi—a company invested in by Zhongyun Technology—is the biggest highlight. This chip represents a significant breakthrough in the context of the intelligent era, integrating sensing, storage, and computing functions into a single compact design—and delivering outstanding low-power performance. This will significantly expand the application potential of chips in a wide range of smart scenarios, including IoT, smart wearables, and smart homes, and is expected to unlock new growth opportunities for related industries while propelling the sector toward a higher level of intelligent innovation.

IV. Significance and Outlook of the Event

The successful hosting of this year's "Beyond Moore, New Leap Forward" event highlights Dongguan City's robust research capabilities and innovative achievements in high-tech fields such as integrated circuits, while also providing a premier platform for companies, research institutions, and experts across the industry to collaborate and exchange ideas. As the organizer, Zhongyun Technology has strengthened its partnerships with various stakeholders through the event, demonstrating its unwavering commitment and expertise in driving the growth of the high-tech sector.

Looking ahead, Zhongyun Technology will increase its investment in core technology areas such as chips, collaborating closely with its subsidiaries—including Guangdong Zhongyun Xindi—and industry partners. Taking the launch of the world's first low-power AI chip that integrates sensing, computing, and memory as a pivotal opportunity, we will continue to explore innovation, driving the accelerated development of the intelligent era and contributing even more to the upgrading of high-tech industries—not only in Dongguan City, but across the entire nation.

We believe that with the joint efforts of all parties, taking this event as a new starting point, the integrated circuit and other related industries will thrive under the guiding vision of "Beyond Moore's Law, Embracing New Quality for Leapfrog Growth," thus ushering in a new chapter for the intelligent era.